Call for Papers

The 32nd IEEE Symposium on High-Performance Interconnects (Hot Interconnects - HotI 2025) will take place virtually from August 20 – 22, 2025.

2025 Conference Theme

Interconnect Software: You can't touch it but you need it

This edition of Hot Interconnects will explore the underlying software ecosystems that empower interconnect fabrics to support a wide array of applications, focusing on the latest advancements in photonics, chips, parallel paths, and other cutting-edge interconnect technologies, and the crucial system software needed to exploit their full potential.

Topics of Interest

• Systems software for communication
• Novel and innovative interconnect architectures
• Accelerator interconnects, e.g. NVLINK, Infinity Fabric
• Network software/hardware designed for AI/ML workloads
• Multi-core processor interconnects
• System-on-Chip Interconnects
• Chiplet-interconnect technologies such as UCIe and BOW
• Advanced chip-to-chip communication technologies
• Optical interconnects
• Protocol and interfaces for inter-processor communication
• Survivability and fault-tolerance of interconnects
• High-speed packet processing engines and network processors
• System and storage area network architectures and protocols
• High-performance host-network interface architectures
• High-bandwidth and low-latency I/O
• Pb/s switching and routing technologies
• Innovative architectures for supporting collective communication
• Novel communication architectures to support cloud & grid computing
• Centralized and distributed cloud interconnects
• Requirements driving high-performance interconnects
• Traffic characterization for HPC systems and commercial data centers
• Software-defined networking and software overlay networks
• Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
• Data Center Networking

Important Dates

• Paper abstract deadline: May 25, 2025 (AOE)
• Submission deadline: May 25, 2025 (AOE)
• Notification of acceptance: July 3, 2025
• Camera-ready due: July 18, 2025

Submission Guidelines

• Papers must be submitted electronically through EasyChair.
• Submissions must conform to IEEE ethics standards.
• Papers will undergo a single-blind review process.

Paper Format

• Regular Papers: Up to 10 pages (including technical content and figures), excluding references and any appendices. Appendices (if any) are limited to 5 pages (extension possible upon committee approval). Reproducibility appendices are encouraged.
• Hot Topic Papers: Up to 4 pages (including technical content and figures), excluding references. Appendices are not allowed. These can be positional papers, industry papers, or papers describing hot-off-the-press breaking research results. They will be judged independently from regular papers. Hot topic papers will not be considered for the IEEE Micro special issue.
• Submissions should include title, author, abstract, and paper in double-column, following IEEE format for details.

Publication

• Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
• Regular papers with the highest review scores may be invited for submission to an IEEE Micro Special Issue.

Best Papers

High impact papers will be considered for:

• Best Industry Paper: (primary author(s) from industry)
• Best Academic Paper: (primary author(s) from academia or non-profit research laboratories)

Call for Tutorials

• Proposals due: June 3, 2025
• Notification of acceptance: June 10, 2025
• Materials due: August 2, 2025