
8月20日 - 2025年8月22日
IEEE Symposium on High-Performance Interconnects
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The 32nd IEEE Symposium on High-Performance Interconnects (HotI 2025) will be held virtually from August 20–22, 2025. It's a premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks. The 2025 conference theme is 'Interconnect Software: You can't touch it but you need it,' exploring the software ecosystems that empower interconnect fabrics.
IEEE Symposium on High-Performance Interconnects (HOTI) 2025: Call for Papers
The 32nd IEEE Symposium on High-Performance Interconnects, Hot Interconnects (HotI 2025), will take place virtually from Wednesday, August 20 – Friday, August 22, 2025.
IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core, on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia.
2025 Conference Theme
Interconnect Software: You can't touch it but you need it
The latest advancements in photonics, chips, parallel paths, and other cutting-edge interconnect technologies are dazzling. However, the picture is incomplete without the system software needed to exploit their full potential. This edition of Hot Interconnects will explore the underlying software ecosystems that empower interconnect fabrics to support a wide array of applications.
Topics of Interest
- Systems software for communication
- Novel and innovative interconnect architectures
- Accelerator interconnects, e.g. NVLINK, Infinity Fabric
- Network software/hardware designed for AI/ML workloads
- Multi-core processor interconnects
- System-on-Chip Interconnects
- Chiplet-interconnect technologies such as UCIe and BOW
- Advanced chip-to-chip communication technologies
- Optical interconnects
- Protocol and interfaces for inter-processor communication
- Survivability and fault-tolerance of interconnects
- High-speed packet processing engines and network processors
- System and storage area network architectures and protocols
- High-performance host-network interface architectures
- High-bandwidth and low-latency I/O
- Pb/s switching and routing technologies
- Innovative architectures for supporting collective communication
- Novel communication architectures to support cloud & grid computing
- Centralized and distributed cloud interconnects
- Requirements driving high-performance interconnects
- Traffic characterization for HPC systems and commercial data centers
- Software-defined networking and software overlay networks
- Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
- Data Center Networking
Paper Format
This year we invite papers to be submitted either as regular (long) papers (up to 10 pages) or as hot topic papers (up to 4 pages). Hot topic papers could be positional papers, industry papers, or papers describing hot-off-the-press breaking research results and will be judged accordingly and independently from the regular papers.
Regular Papers:
- Up to 10 pages (including technical content and figures), excluding references and any appendices.
- Appendices (if any) are limited to 5 pages (the limit might be extended upon committee approval in advance).
- Reproducibility appendices are encouraged but no official verification is provided by the HotI program committee.
- Accepted regular papers may be invited for an [IEEE Micro] Special issue submission.
Hot Topic Papers:
- Up to 4 pages (including technical content and figures) excluding references.
- Appendices are not allowed for hot topic papers.
- Hot topic papers should describe initial research or early first-of-a-kind results (from industry or academia) and will be reviewed independently from the regular papers.
- Hot topic papers will not be considered for IEEE Micro special issue.
General Submission Guidelines:
- Papers need sufficient technical detail to judge quality and suitability for presentation.
- Submissions must conform to IEEE ethics standards.
- Submissions should include title, author, abstract, and paper in double-column, see [IEEE format] for details.
- Papers will be submitted electronically through EasyChair and will undergo a single-blind review process.
- Materials other than the abstract, main paper body, and references will be read at the committee’s discretion.
- After a paper is accepted, the authors must follow the conference and [IEEE CPS guidelines] in publishing the paper.
- Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
Important Dates
- Paper abstract deadline: May 25, 2025 (AOE, firm)
- Submission deadline: May 25, 2025 (AOE, firm)
- Notification of acceptance: July 3, 2025
- Camera-ready due: July 18, 2025
Best Papers
High impact papers will be considered for “Best Industry Paper” (primary author(s) from industry) and “Best Academic Paper” (primary author(s) from academia or non-profit research laboratories) categories.
重要日期
会议日期
Conference Date
2025年8月20日 → 2025年8月22日
投稿
Paper abstract deadline
2025年5月25日
Submission deadline
2025年5月25日
(Call for Tutorials) Proposals due
2025年6月3日
通知
(Call for Tutorials) Notification of acceptance
2025年6月10日
Notification of acceptance
2025年7月3日
终稿
Camera-ready due
2025年7月18日
其他日期
Registration link will be published
2025年7月25日
(Call for Tutorials) Materials due
2025年8月2日
来源排名
来源: CORE2023
排名: National: USA
研究领域: Distributed computing and systems software