Call for Contributions - Embedded Systems Week (ESWEEK) 2025

Embedded Systems Week (ESWEEK) 2025 will take place as an in-person event from September 28 to October 3, 2025, in Taipei, Taiwan.

ESWEEK is the premier event covering all aspects of hardware and software design for intelligent and connected computing systems. It allows attendees to benefit from a wide range of topics by bringing together conferences (CASES, CODES+ISSS, EMSOFT), a symposium (MEMOCODE), and several workshops, tutorials, and education classes.

Submission Types and Venues

ESWEEK has two main publication venues:

1. Journal Track: Full-length papers describing mature work, published in ACM Transactions on Embedded Computing Systems (TECS).
2. Late Breaking (LB) Track: Condensed forms of complete and mature works, published in IEEE Embedded Systems Letters (ESL).

Special Session papers, Keynote abstracts, Tutorial abstracts, and Education class abstracts are also published in the ESWEEK Proceedings.

Important Dates

• Journal Track: Abstract Submission: March 23, 2025 (AOE)
• Journal Track: Full Paper Submission: March 30, 2025 (AOE, firm)
• Special Session Proposals: March 30, 2025 (AOE, firm)
• Tutorial Proposals: March 30, 2025 (AOE, firm)
• Workshops Proposals: March 30, 2025 (AOE, firm)
• Journal track: First Round Notification: May 18, 2025
• Late Breaking Tracks: Paper Submission: June 01, 2025 (AOE, firm)
• Journal track: Revised paper submission: June 15, 2025 (AOE, firm)
• Journal Track, Late Breaking Track: Notification: July 13, 2025
• All tracks (full paper, LB, Special Session): Camera ready: August 11, 2025
• Submission deadline for the Embedded System Software Competition (ESSC) and the ACM SIGBED Student Research Competition: TBD

Author Information and Submission

• All papers must be submitted through the hotCRP management tool from the corresponding web page of each conference (CASES, CODES+ISSS, EMSOFT).
• Corresponding authors must provide their ScholarOne account name and ORCID number during the submission process.
• For publication, each author must provide their ORCID number.

Journal Track Paper Guidelines

• Format: PDF format, following ACM TECS submission guidelines (https://dl.acm.org/journal/tecs/author-guidelines).
• Length: Not exceeding 20 pages in ACM Transactions one-column format for initial submission (references, appendix, etc., are counted).
• Review Process: Double-blind review process. Authors must not reveal their identity directly or indirectly.
• LaTeX Settings: Use \documentclass[manuscript,acmsmall,review,anonymous,screen]{acmart}.
• Revised Manuscripts: If recommended for revision after the first round, revised manuscripts should not exceed 25 pages.

Late-Breaking (LB) Result Track Paper Guidelines

• Format: As indicated at https://ieee-ceda.org/publication/esl/esl-paper-submission.
• Length: Not exceeding 4 pages (IEEE transactions two-column and 10pt font size format).
• Review Process: Double-blind review process. Authors must not reveal their identity directly or indirectly.
• Presentation: Authors of accepted LB papers will present a poster and a lightning talk.
• Video Preview: A 3-minute video preview is required for accepted papers (https://journals.ieeeauthorcenter.ieee.org/create-your-ieee-journal-article/prepare-supplementary-materials).

Work-in-Progress (WiP) Track and Other Papers

Accepted WiP papers, Special Session papers, Tutorial abstracts, and Keynote abstracts are published in the ESWEEK Proceedings.

Registration Requirements

• One full, regular, ESWEEK registration (not a student registration) is required per paper.
• A paper presentation at one of the conferences and a poster presentation are mandatory.

More Information

• CALL FOR PAPERS
• AUTHOR INFORMATION
• ESWEEK Mailing List
• Sponsors

Co-located Events

ESWEEK 2025 includes:

• CASES: International Conference on Compilers, Architectures, and Synthesis for Embedded Systems
• CODES+ISSS: International Conference on Hardware/Software Codesign and System Synthesis
• EMSOFT: International Conference on Embedded Software
• MEMOCODE: Symposium
• Workshops: TCRS, MSC (International Workshop on Memory and Storage Computing), RSP (International Workshop on Rapid System Prototyping)
• Education Classes
• Competitions: EMBEDDED SYSTEMS SOFTWARE COMPETITION (ESSC)
• PhD Forum and Recruiting Event