SLE 2025: Call for Papers

The ACM SIGPLAN International Conference on Software Language Engineering (SLE) is devoted to the principles of software languages: their design, their implementation, and their evolution. Software language engineering (SLE) is the discipline of engineering languages and their tools required for the creation of software.

SLE 2025 will bring together researchers from different areas united by their common interest in the creation, capture, and tooling of software languages. It overlaps with traditional conferences on the design and implementation of programming languages, model-driven engineering, and compiler construction, emphasizing the fusion of these communities.

Venue and Dates

• Location: Koblenz, Germany
• Conference Dates: June 12 - June 13, 2025 (co-located with STAF 2025)

Important Dates

All dates are Anywhere on Earth (AoE).

1. Initial optional abstract submission: February 7, 2025
2. Abstract and paper submission: March 4, 2025
3. Authors response period: April 1 - April 5, 2025
4. Notification: April 15, 2025
5. Artifact Submission Deadline: April 23, 2025

Submission Information

Submissions should be made through the submission website: https://sle25.hotcrp.com.

The conference also features an Artifact Evaluation process.

Community and Conference Websites

• Community website: https://www.sleconf.org/2025
• Conference website: https://conf.researchr.org/home/sle-2025